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Track 2 Session 3
1:00 to 2:00 p.m. Tuesday June 17, 2008
Practical Early Reliability and Failures of PCB Solder
Joints
Early PCB solder failures can
dramatically reduce reliability and increase manufacturing and
maintenance costs if root causes are not effectively fixed. This
presentation examines characteristic early failures of mass produced
PCB assemblies attributed by failure mode analysis to low
solderability of boards or components. Failure signs, symptoms and
root causes are classified, prioritized, characterized and related
to specific technological faults. Analytical approaches and methods
are outlined and proposals are submitted. The presentation is based
on the author’s actual work with several companies, which resulted
in a rare combination of dramatic reliability improvement
accompanied by significant reduction of manufacturing losses. The
general approach, along with the specific methods and
recommendations, are applicable to a broad range of electronic and
electro-mechanical equipment, devices and parts.
Key Words: Early Failures, Failure Analysis, Reliability,
Yield, Solder Joints, Solderability, PCB, Components
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