International Applied Reliability Symposium (ARS): An international reliability and maintainability conference event

Session 10
1:30 p.m. to 2:25 p.m. Friday August 19, 2005

Example of a Thermal Cycle Accelerated Life Test on a Consumer Electronic Component

This presentation will demonstrate the concept of accelerated life testing based on field application data so as to reduce the release test time and cost. The concept is based on accelerated life test data modeling to provide an early indication on what type of failure mode would occur during the warranty period. When accelerated life testing is conducted, the common acceleration mode is voltage, temperature or humidity. This example will present an accelerated life test model subjected to thermal cycles (high and low temperature switching). We shall demonstrate the reliability technique, data analysis and methods used to determine the acceleration factor. The empirical findings and benefits resulting from the example will be shared.

 

 
Alvin Lee, Nagappan Ganesh
Philips Optical Storage

 
Nagappan Ganesh, Beng (Hon), MBA (Innovation and Development), has extensive manufacturing experience in the fast-paced Opto-Electronics industry of Read Only and ReWriteable CD and DVD components manufacturing. He is a trained as a lead auditor in ISO9000 and ISO14000 with experiences in Preventive Maintenance, Quality Control, Glasswall management, Mini-Company, Product Creation Process, Cross Functional Teams and Business Process Teams. Currently, he is working on improving the product quality release methodologies in the development center.

Alvin Lee Geok Sai has been involved in reliability activities since 1999. He is a Certified Reliability Engineer from Singapore Quality Institute. Currently, he is working on the release of "Blu ray" technologies.