2008

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Track 2 Session 4
2:10 to 3:10 p.m. Wednesday, October 22, 2008

Use Forward Voltage Drop to Monitor Semiconductor Junction Temperature During Reliability Testing

Semiconductor junction of integrated circuits or high power LEDs are susceptible to early failure due to excessive internal self heating under certain operating conditions and environment. When running reliability test (e.g., high temperature operating life test) without proper thermal management, the device under test may be over stressed when the junction temperature is too high and vice versa. Therefore, junction temperature monitoring is important during reliability life stress tests to ensure accurate reliability test results. In this presentation, we are using high power LED to demonstrate how forward voltage of LED can be used to measure and monitor junction temperature of the LED and subsequently calculate the thermal resistance of the LED package.

Key Words: Forward voltage drop method, junction temperature, thermal resistance, K-factor calibration, thermal management